SeriesCHIPQUIK®
PackageBulk
TypeSolder Paste
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter-
Melting Point423°F (217°C)
Flux TypeNo-Clean
Wire Gauge-
ProcessLeaded
FormJar, 17.64 oz (500g)
Shelf Life12 Months
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature-