图像仅供参考,请参阅规格书
Series-
PackageBag
Proto Board TypeSMD to DIP
Package AcceptedSOIC, SOP, SSOP
Number of Positions18
Pitch0.100"" (2.54mm)
Board Thickness0.063"" (1.60mm)
MaterialFR4 Epoxy Glass
Size / Dimension0.905"" L x 0.744"" W (23.00mm x 18.90mm)