图像仅供参考,请参阅规格书
Series-
PackageBag
Proto Board TypeSMD to DIP
Package AcceptedSOIC, SOP, SSOP
Number of Positions8
Pitch0.100"" (2.54mm)
Board Thickness0.063"" (1.60mm)
MaterialFR4 Epoxy Glass
Size / Dimension0.433"" L x 0.472"" W (11.00mm x 12.00mm)