封装/外壳:--
Packing Type:HORIZONTAL FRAME SHIPPER
VDS max:1200.0V
Technology:IGBT4 Low Power
Operating Temperature min max:-40.0 °C 175.0 °C
VGE(th) min max:5.3 V 6.3 V
VCE(sat) max:2.07 V
IC max:75.0A
RoHS compliant:yes
Packing Type:HORIZONTAL FRAME SHIPPER
VDS max:1200.0V
Technology:IGBT4 Low Power
Operating Temperature min max:-40.0 °C 175.0 °C
VCE max:1200.0 V
VDS max:1200.0 V
Operating Temperature min max:-40.0°C 175.0°C
VGE(th) min max:5.3 V 6.3 V
VCE(sat) max:2.07 V
VCE max:1200.0V
VCE(sat) max:2.07V
IC max:75.0A
VGE(th) min max:5.3V 6.3V
IC max:75.0 A
RoHS compliant:yes
Packing Type:WAFER SAWN
VDS max:1200.0V
Technology:IGBT4 Low Power
Operating Temperature min max:-40.0 °C 175.0 °C
VCE max:1200.0 V
VDS max:1200.0 V
Operating Temperature min max:-40.0°C 175.0°C
VGE(th) min max:5.3 V 6.3 V
VCE(sat) max:2.07 V
VCE max:1200.0V
VCE(sat) max:2.07V
IC max:75.0A
VGE(th) min max:5.3V 6.3V
IC max:75.0 A
无铅情况/RoHs:无铅/符合RoHs