型号 | 功能描述 | 生产厂商 | 厂商LOGO | PDF大小 | PDF页数 | 下载地址 | 相关型号 |
73644 | Statshield Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 612.42 Kbytes | 共4页 |  | 无 |
73644 | Statshield Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 612.42 Kbytes | 共4页 |  | 无 |
73644 | Statshield Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 612.42 Kbytes | 共4页 |  | 无 |
73644 | Statshield Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 612.42 Kbytes | 共4页 |  | 无 |
73644 | ESD Statshield Protective Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 609.82 Kbytes | 共4页 |  | 无 |
73644 | Statshield Smocks Grounding, Testing and Maintenance | ETC2[List of Unclassifed Manufacturers] | ![ETC2[List of Unclassifed Manufacturers]的LOGO](/PdfSupLogo/843ETC2.GIF) | 612.42 Kbytes | 共4页 |  | 无 |
73644-0000 | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.6 Kbytes | 共4页 |  | 无 |
73644-0001 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.59 Kbytes | 共4页 |  | 无 |
73644-0002 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0003 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 170.31 Kbytes | 共4页 |  | 无 |
73644-0004 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position C, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.02 Kbytes | 共4页 |  | 无 |
73644-0005 | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0006 | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0008 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position E, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0009 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.02 Kbytes | 共4页 |  | 无 |
73644-0012 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position G, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0013 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position G, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 170.31 Kbytes | 共4页 |  | 无 |
73644-0016 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.61 Kbytes | 共4页 |  | 无 |
73644-0017 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.61 Kbytes | 共4页 |  | 无 |
73644-0018 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location N/A, Polarizing Key Position N/A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 170.3 Kbytes | 共4页 |  | 无 |
73644-00209 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location A, Polarizing Key Position E, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0106 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position D, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 170.31 Kbytes | 共4页 |  | 无 |
73644-0116 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position N/A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0117 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position N/A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 170.31 Kbytes | 共4页 |  | 无 |
73644-0200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position A, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.6 Kbytes | 共4页 |  | 无 |
73644-0201 | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, SMC, Press- Fit, Guide Post Location A | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.6 Kbytes | 共4页 |  | 无 |
73644-0202 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location B, Polarizing Key Position B, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0203 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Guide Post Location A, Polarizing Key Position B, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.03 Kbytes | 共4页 |  | 无 |
73644-0204 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Guide Post Location B, Polarizing Key Position C, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 178.02 Kbytes | 共4页 |  | 无 |
736440205 | Conn Hard Metric HDR 72 POS 2mm Press Fit ST Thru-Hole HDM? Tube | MOLEX |  | 24.78 Kbytes | 共2页 |  | 无 |