类型：Backplane

间距：2 mm

行数：4

触点数：24

端接方式：Press Fit

安装：Through Hole

触点电镀：Gold

标准包装：Bulk

PCB安装角度：Vertical

模块类型：Signal

外壳材料：Liquid Crystal Polymer (LCP)

发表类型：Press-Fit

信号位置数：24

RoHSELV合规性：RoHS compliant, ELV compliant

Lead Free Solder Processes：Not relevant for lead free process

发表电镀：Tin

排序：Yes

产品类型：Fixed-Board (Header)

额定电压（VAC ）：30

先通后断：Yes

触点区域镀层材料：Gold (30)

脚头宽度（毫米（ ） ）：16.00 [0.622]

评论：With sequenced contacts. Refer to customer drawing for specific loading pattern

测序配置B行：Mating Post Length 6.5mm, Termination Post Length 4.25mm

测序配置行C：Mating Post Length 6.5mm, Termination Post Length 4.25mm

测序配置行答：Mating Post Length 8mm, Termination Post Length 4.25mm

测序配置D排：Mating Post Length 6.5mm, Termination Post Length 4.25mm

中心线矩阵（毫米（ ） ）：2.00 x 2.00 [.079 x .079]

RoHSELV符合记录：Always was RoHS compliant

触点材料：Phosphor Bronze