类型:Power
型式:HDR
触点数:35
端接方式:Solder
安装:Through Hole
样式:Straight
标准包装:Bulk
RoHSELV合规性:ELV compliant
Lead Free Solder Processes:Not reviewed for lead free solder process
安装角度:Vertical
颜色:Natural
垫片:Without
包装方式:Loose Piece
外壳材料:Thermoplastic
要终止:Panel, Printed Circuit Board
触点区域镀层材料:Tin
产品类型:Header Assembly
RoHSELV符合记录:Converted to comply with ELV directive
位置数:35
标准包装:1