型号 | 功能描述 | 生产厂商 | 厂商LOGO | PDF大小 | PDF页数 | 下载地址 | 相关型号 |
73943 | B736 2X12 BLK/YEL 25/RL PM-TO-GO | Brady Corporation |  | 153.85 Kbytes | 共3页 |  | 无 |
73943 | Torx Power Bit T25 x 70 mm, 2 Pack | Wiha Tools |  | 8.97 Mbytes | 共64页 |  | 无 |
73943 | Piper Marker; "Water"; Plastic; 2"W x 12"L; Black on Yellow | Brady |  | 158.73 Kbytes | 共3页 |  | 无 |
73943-0000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-0200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-1000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-1200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail Closed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-2000 | 2.54mm (.100 | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-22 | 0.22 μF 薄膜电容器 275V 630V 聚丙烯(PP),金属化 径向 | Iskra |  | 2.66 Mbytes | 共4页 |  | 无 |
73943-2200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.43 Kbytes | 共4页 |  | 无 |
73943-3000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.23 Kbytes | 共4页 |  | 无 |
73943-3200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.43 Kbytes | 共4页 |  | 无 |
73943-4000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.41 Kbytes | 共4页 |  | 无 |
73943-4200 | 2.00mm (.079") Pitch HDM Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.43 Kbytes | 共4页 |  | 无 |
73943-5000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.24 Kbytes | 共4页 |  | 无 |
73943-5100 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail, Closed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.08 Kbytes | 共4页 |  | 无 |
73943-5200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.24 Kbytes | 共4页 |  | 无 |
73943-6000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.43 Kbytes | 共4页 |  | 无 |
73943-6200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail,Closed End, 72 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.24 Kbytes | 共4页 |  | 无 |
73943-7000 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail,Closed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.43 Kbytes | 共4页 |  | 无 |
73943-7100 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder Tail,Closed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.08 Kbytes | 共4页 |  | 无 |
73943-7200 | 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, Solder TailClosed End, 144 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 147.24 Kbytes | 共4页 |  | 无 |