SeriesC511™
PackageBulk
TypeWire Solder
CompositionSn95.5Ag3.8Cu0.7 (95.5/3.8/0.7)
Diameter0.032" (0.81mm)
Melting Point423°F (217°C)
Flux TypeNo-Clean
Wire Gauge20 AWG, 21 SWG
ProcessLead Free
FormSpool, 1 lb (454 g)
Shelf Life-
Shelf Life Start-
Storage/Refrigeration Temperature-