类型：Backplane

间距：2 mm

行数：5

触点数：240

端接方式：Press Fit

安装：Through Hole

触点电镀：Gold

标准包装：Bulk

PCB安装角度：Vertical

模块类型：Signal

外壳材料：Liquid Crystal Polymer (LCP)

发表类型：Press-Fit

信号位置数：240

RoHSELV合规性：RoHS compliant, ELV compliant

Lead Free Solder Processes：Not relevant for lead free process

发表电镀：Tin

排序：Yes

产品类型：Fixed-Board (Header)

额定电压（VAC ）：30

先通后断：Yes

触点区域镀层材料：Gold (30)

脚头宽度（毫米（ ） ）：18.00 [0.709]

评论：With sequenced contacts. Refer to customer drawing for specific loading pattern

测序配置B行：Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 8

测序配置行C：Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 8

测序配置行答：Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 6

测序配置D排：Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 5

测序配置E行：Mating Post Length 5.75mm, Termination Post Length 4.25mm, Mating Post Length 5

中心线矩阵（毫米（ ） ）：2.00 x 2.00 [.079 x .079]

RoHSELV符合记录：Always was RoHS compliant

触点材料：Phosphor Bronze