Series4900
PackageBulk
TypeSolder Paste
CompositionSn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter-
Melting Point423 ~ 430°F (217 ~ 221°C)
Flux TypeNo-Clean
Wire Gauge-
ProcessLead Free
FormJar, 8.8 oz (250g)
Shelf Life24 Months
Shelf Life StartDate of Manufacture
Storage/Refrigeration Temperature35°F ~ 50°F (2°C ~ 10°C)