型号 | 功能描述 | 生产厂商 | 厂商LOGO | PDF大小 | PDF页数 | 下载地址 | 相关型号 |
15-47-7608 | 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating | MOLEX2[Molex Electronics Ltd.] | ![MOLEX2[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/824MOLEX2.GIF) | 388.51 Kbytes | 共4页 |  | 无 |
15-47-7608 | 2.54mm (.100) Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 6 Circuits, Tin (Sn) Plating | MOLEX2[Molex Electronics Ltd.] | ![MOLEX2[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/824MOLEX2.GIF) | 388.49 Kbytes | 共4页 |  | 无 |
15-47-7608 | 2.54mm Pitch C-Grid® Header, Through Hole, Dual Row, Vertical, High Temperature, | MOLEX11[Molex Electronics Ltd.] | ![MOLEX11[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/833MOLEX11.GIF) | 35.62 Kbytes | 共2页 |  | 无 |