型号 | 功能描述 | 生产厂商 | 厂商LOGO | PDF大小 | PDF页数 | 下载地址 | 相关型号 |
07028 | 模拟面板表 1327 0-150% 0-30 | Simpson Electric Company |  | 421.62 Kbytes | 共10页 |  | 无 |
0702800365 | CONN HEADER VERT 12POS 2.54MM | Molex |  | 107.54 Kbytes | 共3页 |  | 无 |
0702800367 | CONN HEADER VERT 16POS 2.54MM | Molex |  | 107.54 Kbytes | 共3页 |  | 无 |
0702800368 | CONN HEADER VERT 18POS 2.54MM | Molex |  | 107.54 Kbytes | 共3页 |  | 无 |
0702800387 | CONN HEADER VERT 56POS 2.54MM | Molex |  | 107.54 Kbytes | 共3页 |  | 无 |
0702800439 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 82 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.82 Kbytes | 共4页 |  | 无 |
0702800440 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 84 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800441 | 2.54mm (.100 | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800442 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 88 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800443 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800444 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 92 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800445 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 94 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.82 Kbytes | 共4页 |  | 无 |
0702800446 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 96 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800447 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 98 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.83 Kbytes | 共4页 |  | 无 |
0702800448 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, Tin (Sn) Plating, 2.72mm (.107") PC Tail Length | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.82 Kbytes | 共4页 |  | 无 |
0702800449 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800450 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 84 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800451 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 86 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800452 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 88 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800453 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800454 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 92 Circuits, 0.38um | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800455 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 94 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.94 Kbytes | 共4页 |  | 无 |
0702800456 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 96 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800457 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 98 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.87 Kbytes | 共4页 |  | 无 |
0702800458 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 100 Circuits, 0.38μm (15μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800459 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 82 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating, 2.72mm (.107") PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.87 Kbytes | 共4页 |  | 无 |
0702800460 | 2.54mm (.100) Pitch C-Grid® Breakaway Header, Dual Row, Vertical, High Temperature, 84 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800461 | 2.54mm (.100") Pitch C-Grid Breakaway Header, Dual Row, Vertical, High Temperature, 86 Circuits | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800462 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 88 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |
0702800463 | 2.54mm (.100") Pitch C-Grid® Breakaway Header, Dual Row, Vertical, HighTemperature, 90 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating, Tin (Sn) PC Tail | MOLEX8[Molex Electronics Ltd.] | ![MOLEX8[Molex Electronics Ltd.]的LOGO](/PdfSupLogo/830MOLEX8.GIF) | 294.88 Kbytes | 共4页 |  | 无 |